ADHESIVES, GLUES AND SEALANTS
Physical adhesives are those glues that have the base polymer already formed but dissolved, requiring the application of physical effects such as temperature or pressure to generate the phenomenon of adhesion and cohesion of the adhesive.
The main difference compare chemical curing adhesives over physical curing adhesives is that the chemical curing adhesive polymer is formed by a series of chemical reactions, while the physical curing adhesives already have the polymer.
Physical curing adhesive composition:
Binder: thermoplastics, occasionally elastomers
Fillers: silica, clay, aluminum powder ...
Additives: fire retardants, emulsifiers, rheology promoters, solvents, dispersants, plasticizers ...
The physical curing adhesives have a mechanical properties and resistance to environmental and physical effects (temperature, radiation) lower than the chemical curing adhesives.
Properties of physical curing adhesives:
Resistance to temperatures above 100 ° C, for adhesives such as hotmelts based on polyamide can reach 190 ° C.
Average fracture toughness against impact loads can reach 25 MPa.
High elongation before fracture, achieving more than 600% elongation.
Generally physical curing adhesives have poor resistance to moisture and the environment.
Below there is a list of all the physical curing adhesives:
Solvent based adhesives
Pressure sensitive adhesives (PSA)
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